NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.
New Generation Cu Wire EX
Fine Au Wire
High Drop Impact Resistance
Micro Ball
13 / 04 / 2018
IATF16949 Certification
29 / 12 / 2017
TS16949 Certification(NMC Philippines)
29 / 04 / 2015
Address change of Hangzhou New Material Chroma
10 / 04 / 2015
ISO/TS16949:2009 Certification
18 / 01 / 2013
Address Change of NMC Malaysia
New Generation
Cu Wire EX
Fine Au Wire
Micro Ball
Company Profile
Access/Network
Quality and environmental policy
Non-use of conflict metals