NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.

Company overview

Non-use of conflict metals

     We,Nippon Micrometal Corporation (including the subsidiaries and/or affiliates of our company),  assure that our products(Bonding wire and Solder Ball)do not use the conflict metal ores(Gold  and Tin) origin from the Democratic Republic of Congo and the other troubled regions. 

     In case we change the raw material procurement, we select the materials which are not produced in the above-mentioned area. 

 

October 2014 
Nippon Micrometal Corporation
Environment management Sec.
 

pagetop