- Klengel, et al., “Silver bonding wire – an alternative for mechanical sensitive chip configurations in automotive electronics packaging”, EMPC, 2023 (9)
- T. Yamaguchi, et al., “Investigation of failure mechanism of aluminum-scandium wire bond contact under active power cycle test”, Microelectronics Reliability, volume 144, 2023 (5).
- Y. Suto, et al., “Failure analysis of aluminum-scandium wire and aluminum pad bond interface in power cycle test”, MATE, 2023 (1).
- R. Klengel, et al., “Comprehensive study of long-term reliability of copper bonding wires at harsh automotive conditions”, ECTC, 2022 (5).
- S. Schmitz, et al., “Advanced bonding interface inspection technique for process optimization in heavy wire bonding”, IMAPS, 2021 (10).
- R. Klengel, et al., “Corrosion effects and reliability improvement of silver wire bonded contacts in automotive application”, EMPC, 2021 (9).
- M. Eto, et al., “Microstructural characterization of alloyed palladium coated copper wire under high temperature”, Microelectronics Reliability, volume 120, 2021 (5).
- M. Eto, et al., “Influence of post-bonding heating process on the long-term reliability of Cu/Al contact”, Microelectronics Reliability, volume 118, 2021 (3).
- M. Eto, et al., “Effects of alloying elements in high reliability copper wire bond material for high temperature applications”, Microelectronics Reliability, volume 4, 2020 (10).
- R. Klengel, et al., “How copper wire material additive elements effect the reliability of wire bonded contacts in HAST testing”, ESTC, 2020 (9).
- R. Klengel, et al., “Influence of copper wire material additive elements to the reliability of wire bonded contacts”, ECTC, 2020(5).
- N. Araki, et al., “High bond reliability of newly developed silver alloy bonding wire”, IMAPS, 2019 (10). ⇒Best session award.
- G. Lorenz, et al., “Investigation of mechanical and microstructural properties of a new corrosion resistant gold-palladium coated copper bond wire”, EMPC, 2019 (9).
- S. Klengel, et al., “Influence of copper wire material to corrosion resistant packages and systems for high temperature applications”, EMPC, 2019 (9). ⇒Outstanding paper award.
- S. Klengel, et al., “A new reliable, corrosion resistant gold-palladium coated copper wire material”, ECTC, 2019 (5).
- N. Araki, et al., “Investigation for highly reliable free air ball formation for silver bonding wire”, ECTC, 2018 (5).
- M. Eto, et al., “Newly developed high reliability palladium coated Cu wire for automotive application”, EMPC, 2017 (9).
- M. Eto, et al., “Thermal bond reliability of high reliability new palladium-coated copper wire”, ECTC, 2017 (5).
- N. Araki, et al., “Effect of process parameters on Free Air Ball integrity in copper and palladium-coated copper bonding wires”, IMAPS, 2014 (10).
- N. Araki, et al., “A study of Free Air Ball formation in Pd coated Cu and bare Cu bonding wires”, ECTC, 2013 (5).
