Products
Bonding wire
BX（Bare Cu bonding wire）
■ Products
Our bare Cu wires (BX series) are characterized by longer floor life and higher bondability compared with conventional bare Cu wire. They are available in various diameters from fine diameters for general purposes to very thick diameters for power device application.
Product lineup
BX1
BX1 achieves higher 2nd bond strength and longer floor life (10 days guarantee after opening the sealed bag) than conventional bare Cu wire.
BX2
BX2 is an alloyed Cu wire with low electrical resistivity (2.0μΩcm). while maintaining all the benefits of BX1, BX2 achieves improved bonded ball shape and long-term reliability.
BX series: key features
| Item | BX2 | BX1 | Ref. |
|---|---|---|---|
| Resistivity (RT) | 2.0µΩcm | 1.8µΩcm | |
| 2nd pull force | ◎ | ◎ | △ |
| Floor life | 10days | <7days | |
| Bonded ball shape | ◎ | ○ | △ |
| Long term reliability | ◎ | ○ | ○ |
BX2: long term reliability
HTSL-175℃
BX2: Bonded ball shape / Reverse bonding
Bonded ball shape
Reverse bonding