NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.
Product information
Micro Ball
|
Our micro ball has excellent mountability and long period life span.
It can use for various packaging of BGA, CSP and Flip Chip.
|
Lead Free
|
Series |
Chemical Composition |
Melting Point（degC） |
Pat. No |
|
|
LF |
LF38（SAC105) |
Sn/Ag1.0/Cu0.5 |
217～227 |
　 |
|
LF35 |
Sn/Ag1.2/Cu0.5/Ni0.05 |
217～227 |
JP PAT No. 4152596 |
|
|
AF11 |
Ag Free |
221～225 |
JP PAT No. Â Â Â Â Â Â Â 1 application |
|
| World PAT No. | ||||
|
 1 application |
||||
|
LF45（SAC305) |
Sn/Ag3.0/Cu0.5 |
217～219 |
　 |
|
|
LF31（SAC405) |
Sn/Ag4.0/Cu0.5 |
217～219 |
　 |
|
|
LF60 |
Au80/Sn20 |
 Around 278 |
　 |
|
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Lead free micro solder ball is controlled its lead impurities within 0.05ï¼….
We meet customer's requirements based from metallurgical knowledge by NIPPON STEEL CORPORATION.
Tolerance
| Ball diameter (μm) | Tolerance (μm) |
| 50≦ D ＜100 | ±3 |
| 100≦ D ＜150 | ±5 |
| 150≦ D ≦400 | ±10 |
＊The diameter of LF60 (Au80Sn20) is limited to 50-200μm.
Micro Solder Ball Brochure DownLoad　
　(505KB)
