NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.

Product information

Micro Ball

 

 

Our micro ball has excellent mountability and long period life span. 
It can use for various packaging of BGA, CSP and Flip Chip.

Lead Free

Series

Chemical Composition

Melting PointdegC

Pat. No

LF

LF38SAC105)

Sn/Ag1.0/Cu0.5

217227

 

LF35

Sn/Ag1.2/Cu0.5/Ni0.05

217227

JP PAT No. 4152596

AF11

Ag Free

221225

JP PAT No.              1 application

World PAT No.

 1 application

LF45SAC305)

Sn/Ag3.0/Cu0.5

217219

 

LF31SAC405)

Sn/Ag4.0/Cu0.5

217219

 

LF60

Au80/Sn20

 Around 278

 

 

Lead free micro solder ball is controlled its lead impurities within 0.05%.

We meet customer's requirements based from metallurgical knowledge by NIPPON STEEL CORPORATION.

Tolerance

Ball diameter (μm) Tolerance (μm)
50≦ D <100 ±3
100≦ D <150 ±5
150≦ D ≦400 ±10

*The diameter of LF60 (Au80Sn20) is limited to 50-200μm.

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