NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.

Product information

Micro Ball

 

 

Our micro ball has excellent mountability and long period life span. 
It can use for various packaging of BGA, CSP and Flip Chip.

Lead Free

Serie

Compositio

Melting point(℃)

Pat. No

LF60

Au80/Sn20

278

 

LF35

Sn/Ag1.2/Cu0.5/Ni0.05

217~227

JP 4152596

LF210N Sn / Ag2.0 / Cul.0 / Ni0.05 217 ~ 227 JP 3796181
JP 4391276

LF45

Sn/Ag3.0/Cu0.5

217~219

JP 3027441
US 5527628

LF31

Sn/Ag4.0/Cu0.5

217~219

JP 3027441

 

Tolerance

Ball diameter (μm) Tolerance (μm)
D <100 ±3
100≦ D <150 ±5
150≦ D ≦400 ±10

 

 

LF35 is our original product for handheld electronic product applications, which provides an excellent drop performance of surface mount electronic components.

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