NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.
Product information
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Â
Â
Our micro ball has excellent mountability and long period life span.Â
It can use for various packaging of BGA, CSP and Flip Chip.
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Lead Free
Serie |
Compositio |
Melting point(℃) |
Pat. No |
LF60 |
Au80/Sn20 |
278 |
  |
LF35 |
Sn/Ag1.2/Cu0.5/Ni0.05 |
217~227 |
JPÂ 4152596 |
LF210N | Sn / Ag2.0 / Cul.0 / Ni0.05 | 217 ~ 227 | JP 3796181 JP 4391276 |
LF45 |
Sn/Ag3.0/Cu0.5 |
217~219 |
JP 3027441 |
LF31 |
Sn/Ag4.0/Cu0.5 |
217~219 |
JP 3027441 |
Â
Tolerance
Ball diameter (μm) | Tolerance (μm) |
D <100 | ±3 |
100≦ D <150 | ±5 |
150≦ D ≦400 | ±10 |
Â
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LF35 is our original product for handheld electronic product applications, which provides an excellent drop performance of surface mount electronic components.