Micro Ball

Our micro ball has excellent mountability and long period life span.
It can use for various packaging of BGA, CSP and Flip Chip.

Lead Free

Serie	Compositio	Melting point（℃）	Pat. No
LF60	Au80/Sn20	278
LF35	Sn/Ag1.2/Cu0.5/Ni0.05	217～227	JP 4152596
LF210N	Sn / Ag2.0 / Cul.0 / Ni0.05	217 ~ 227	JP 3796181 JP 4391276
LF45	Sn/Ag3.0/Cu0.5	217～219	JP 3027441 US 5527628
LF31	Sn/Ag4.0/Cu0.5	217～219	JP 3027441

Tolerance

Ball diameter (μm)	Tolerance (μm)
D ＜100	±3
100≦ D ＜150	±5
150≦ D ≦400	±10

LF35 is our original product for handheld electronic product applications, which provides an excellent drop performance of surface mount electronic components.