NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.
Product information
About Bonding wire
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Bonding wire is materials with Connectivity for semiconductor packaging conveys electrical signals to the outside of the semiconductor device.
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These wires enable us to challenge the limites of bonding technologies through thnner wires,longer span and finer piches
Au 4N Series Wire (Au purity ≧ 99.99%)
AT series     | Good for long span and fine pitch bonding. ・Wire span :7mm ・Loop height:90μm ・Pad pitch:60μm                    ・Breaking load(25μm):147mN(15g)    |
T series  | Versatile wire. T series can meet for long span bonding and trapezoid short span bonding for BGA and other many packages. |
Alloy Wire (Au purity ≧ 99%)
G series | G series can bond by 2N wire bonding parameter and it shows high reliability performance.  |