New Generation Cu Wire EX

Advanced Cu Wire "EX"

Bonding wire is materials with Connectivity for semiconductor packaging conveys electrical signals to the outside of the semiconductor device.

Copper is much cheaper than Gold, so copper wires can realize huge cost saving for a semiconductor packaging company. On the other hand, there are many difficulties to adopt to copper wires for advanced packages. For example, the oxidation of copper material is inherent, so customers need to take care of stability of wege-bonding, shelf-life, and storage.
EX1 wire can resolve most of these issues and realize the use of copper wire for the advanced packages.

It's possible to use EX for fine applications.

EX1 use for Fine IC Package (EX1-18um)

EX1 provides customers with huge benefits.

1) Stability and Much better 2nd Bonderability.
2) Bonding operation requires only N2 gas.
3) Long winding length like gold wires.

Characteristics of EX

	Productivity	Reliability	Adoptive PKGs	Initial Investment	Price	Total Value
EX1p	◎	○	◎	○	○	◎
EX1	○	○	○	○	○	○
Conventional Cu Wire	△	△	△	△	◎	△
Au Wire	◎	◎	◎	◎	×	△

◎Excellent ○Good △Fair ×Not Good

	EX	Conventional Cu
2nd Pull Strength	1.5～2times	1
Spool Life(air)	>60days	<7days
Spooled Length	～5,000m	500～1,000m
Shield Gas	N2+5%H2 , pure N2	N2+5%H2
Seeling Bag (for store)	No Need	Must

2nd Pull Strength & shelf Life / Bonding Image (EX1-23um)

Pd Coated Cu Wire Brochure DownLoad　　(402KB)