NIPPON MICROMETAL CORPORATION provides Bonding wire and Micro solder ball.

Product information

New Generation Cu Wire EX

Advanced Cu Wire "EX"

 

 

 

Bonding wire is materials with Connectivity for semiconductor packaging conveys electrical signals to the outside of the semiconductor device.

Copper is much cheaper than Gold, so copper wires can realize huge cost saving for a semiconductor packaging company. On the other hand, there are many difficulties to adopt to copper wires for advanced packages. For example, the oxidation of copper material is inherent, so customers need to take care of stability of wege-bonding, shelf-life, and storage.
EX1 wire can resolve most of these issues and realize the use of copper wire for the advanced packages.

It's possible to use EX for fine applications.

EX1 use for Fine IC Package (EX1-18um)
EX1 use for Fine IC Package (EX1-18um)

 

 

EX1 provides customers with huge benefits.


1) Stability and Much better 2nd Bonderability.
2) Bonding operation requires only N2 gas.
3) Long winding length like gold wires.

 

Characteristics of EX

 Item EX1R EX1F EX1p EX1
Copper Core Material 2N 2N~3N 4N
HAST Reliability
HTS >= 175 degC
Pd Distribution
Stitch Strength
2nd Peeling
Pad Damage/Metal Peeling
Lifetime in air

◎better  〇good  △Fair  

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